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7. Product Specification
MSAP2000 Technical Manual V3.0 7-i
Table of Contents
7. Product Specification............................................................................................................7-1
7.1. Overview................................................................................................................ 7-1
7.2. Main Components ................................................................................................. 7-2
7.3. Common Shelf....................................................................................................... 7-4
7.4. Central Office Power Supply Module (CoPSM)..................................................... 7-7
7.5. Remote Terminal Power Supply Module (RtPSM).............................................. 7-10
7.6. Main Processing Module (MPM) ......................................................................... 7-13
7.7. Expansion Link Module (ELM)............................................................................. 7-16
7.8. Expansion Processing Module (EPM)................................................................. 7-19
7.9. Metallic Line Testing Module (MLTM) ................................................................. 7-22
7.10. V5.2 Processing Module (V5P) ........................................................................... 7-25
7.11. Packet Voice Module (PVM)................................................................................ 7-28
7.12. STM-1 Module (SM1) .......................................................................................... 7-31
7.13. STM-4 Module (SM4) .......................................................................................... 7-34
7.14. Optical Interface Module (OIM) ........................................................................... 7-37
7.15. Quad E1 Module (QE1M).................................................................................... 7-40
7.16. Foreign Exchange Office Module (FXO) ............................................................. 7-43
7.17. Foreign Exchange Station Module (FXS)............................................................ 7-46
7.18. Foreign Exchange Office Payphone Module (FXO-P) ........................................ 7-49
7.19. Foreign Exchange Station Payphone Module (FXS-P)....................................... 7-52
7.20. 2W/4W Ear and Mouth Module (2W/4W E&M) ................................................... 7-55
7.21. G.SHDSL Module (GSH)..................................................................................... 7-58
7.22. U Interface Network Terminal Module (ISDN-U LUNT)....................................... 7-62
7.23. ISDN U Interface Line Terminal Module (ISDN-U LULT).................................... 7-65
7.24. Nx64 Module for Data Leased Service (N64M)................................................... 7-68
7.25. Gigabit Ethernet Module (GbE) ........................................................................... 7-71
7.26. Optical Gigabit Switch(OGS) ............................................................................... 7-74
7.27. RT Ethernet over SDH Module (REoSM)............................................................ 7-77
7.28. COT Ethernet over SDH Module (CEoSM) ......................................................... 7-80
7.29. Ethernet Module (ETH)........................................................................................ 7-83
7.30. Ethernet Switching Module (ESM)....................................................................... 7-86
7.31. ADSL2/2+ Access Module (AAM) ....................................................................... 7-89
7.32. Passive Mux Module(PMM)................................................................................. 7-92
7.33. G.SHDSL Remote CPE (GSH-R)........................................................................ 7-95
- MSAP2000 1
- Technical Manual 1
- ZyXEL Technologies Inc 2
- About This Manual 4
- Conventions 5
- Environmental Protection 5
- Table of Contents 10
- THIS PAGE IS LEFT BLANK 11
- 1. System Introduction 12
- 1.2. Key Features 13
- 1.3. System Architecture 16
- 1.5. Testing and maintenance 18
- 2. System Architecture 21
- 2.2. SDH ADM 22
- 2.3. NG DLC 23
- 2.4. E1 Multiplexer 25
- 2.5. IP DSLAM 26
- 2.6. Gigabit Switch 27
- 2.7. VoIP Gateway 28
- 2.8. Layer 2 Switch 30
- 2.9. Digital Cross Connect 31
- 2.10. Flexible Topology 32
- 2.11. Local Craft Terminal 34
- 3. Application and Services 39
- 3.4. Optical Transportation 42
- 4. System Components 52
- 4.2. Terminal 53
- 4.3. Shelf 54
- 4.4. Common Control Modules 57
- 4.5. Trunk Interface Module 59
- 4.9. Indoor Rack 67
- 5. System Configuration 71
- 5.1. Slot Chart 73
- 5.2. Module Capacity 74
- Configuration (STM-1) 89
- Configuration 91
- 6.2. Clock Synchronization 100
- 6. System Design 101
- 6.4. Reliability 103
- 6.6. IP DSLAM Design 105
- 7. Product Specification 107
- 7.2. Main Components 109
- 7.3. Common Shelf 111
- Modules CoPSMModules 114
- MPMModule 123
- Local node communication 123
- Module EPMModule 123
- ELM MPMModule 126
- 7.12. STM-1 Module (SM1) 138
- 7.13. STM-4 Module (SM4) 141
- 7.15. Quad E1 Module (QE1M) 147
- 7.21. G.SHDSL Module (GSH) 165
- 7.29. Ethernet Module (ETH) 190
- 8. System Management 207
- 8.3. Telnet 209
- 刪除: ZyFLEX 210
- 9. NMS Management Functions 215
- 9.2. Configuration 216
- 9.4. Fault Management (FM) 218
- 9.5. Maintenance 220
- 9.6. Security 223
- Environment 226
- 10.2. Environment Conditions 227
- 11.1. STM-1 230
- 11.2. STM-4 231
- 11.3. Gigabit 232
- 11.4. E1 233
- 11.5. POTS 236
- : > 15 dB 237
- 11.6. Pay Phones 238
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